MICRESS® 

 A gallery of simulation results  for solders and solder type alloys
(to be completed)
 

ternary_eutectic Directional Solidification of a ternary eutectic alloy
composed of In Bi22.3 Sn17.8


solder on substrate
Solidification of a ternary Sn-3.0Ag-0.5Cu on a copper  substrate (B.Zhou, B.Böttger and G.J.Schmitz)  unpublished results


solder directional_dendritic
Solidifying dendrites of beta-Sn engulfing Ag3Sn and Cu6Sn5 particles (B.Zhou, B.Böttger and G.J.Schmitz, unpublished results)